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FLIR

Blackfly®S

BFS-U3-50S5-BD2

 

Case Temperature and Heat Dissipation

You must provide sufficient heat dissipation to control the internal operating temperature of the camera.

The camera is equipped with an on-board temperature sensor. It allows you to obtain the temperature of the camera FPGA junction temperature. The temperature must be kept under 100°C. Some models may not require heat sinking depending on the mode of operation.

  As a result of packing the camera electronics into a small space, the camera can become hot to the touch when running. For board-level models, the temperature must be kept under 100°C and therefore may require a heat sink to avoid damage.

To reduce heat, use a cooling fan to set up a positive air flow around the camera, taking into consideration the following precautions:

  • Mount the camera on a heat sink, such as a camera mounting bracket, made out of a heat-conductive material like aluminum. When designing a heat sink for a board-level model, respect the Keepout Layer.
  • Make sure the flow of heat from the camera to the bracket is not blocked by a non-conductive material like plastic.
  • Make sure the camera has enough open space around it to facilitate the free flow of air.

Device temperature can be monitored in SpinView as follows:

  • Select Device_Temperature_Selector Enum Node
  • Set Device_Temperature_Selector Enum Node Value to Mainboard
  • Read Device_Temperature Node

 

6/28/2018
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Blackfly®S BFS-U3-50S5-BD2
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